travail du bois adhésif Chip Board EVA-JF-108 de fonte chaude du bois d'Edgebanding de 200 matériaux de ℃

Hot Selling Online Shop EVA Hot Melt Adhesive WANLI® EVA-JF-108 with Viscosity 70000±10000mpa·s (200℃) for Chip Board Edge Bonding with Lower Cost Wanli® EVA hot melt adhesive JF-108 for edge bonding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for ...

1500mpa·Fonte chaude Chip Board Woodworking adhésif EVA-JF-202 de S Edgebanding

Factory Directly Supply EVA Hot Melt Adhesive WANLI® EVA-JF-202 with Viscosity 11500±1500mpa·s (180℃) for Chip Board Edge Bonding Wanli® EVA hot melt adhesive JF-202 for 3D lamination & edgebanding is a ethylene-vinyl acetate copolymer with 100% solid content. It is specifically developed for 3D ...