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chip low temperature hot melt glue
6 Items Found
Polypropylène blanc PUR-XBB768 de colle de fonte de Chip Edgebanding Low Temperature Hot
Moisture-curing reactive adhesive PUR-XBB768 ensures superior bonding strength and high-quality appearance in edgebanding applications. The quality of the edgebanding is increasingly becoming a key criterion for evaluating the quality of the entire furniture item in high-quality furniture manufactur...
Reliure EVA-KG-6D industrielle blanche d'adhésifs de fonte d'EVA de puce
Hot Sale Good Quality & Low Cost, Viscosity 7000±1000mpa·s (@160℃) White Chips Bulk WANLI® KG-6D EVA Hot Melt for Book Back Binding at Paper Weight of 50-60G/m² Wanli® EVA hot melt adhesive KG-6D for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. KG-6D is developed ...
Adhésifs thermofusibles pour bandes de chant 10 ~ 15 secondes Colle PUR solide PUR-XCS637
New Hot Selling & Low Cost WANLI® PUR-XCS637 Ivory-White 100% Solid Reactive PUR Hot Melt Adhesive for Chip Board Edge Bonding Application And Provides Invisible Glueline Wanli® PUR hot melt adhesive PUR-XCS637 for edge bonding is a single-component reactive PUR hot melt adhesive with 100% solid ...
Solide EVA-C-21 floconneux d'EVA Hot Melt Adhesives Yellowish de 4800 Cps
Hot Sale Factory Direct Bulk Light Yellow Chips EVA Hotmelt WANLI® C-21 with Viscosity 4800±800mpa·s (130℃) for Book Cover Bonding at Paper Weight ≤200G/m² Wanli® EVA hotmelt adhesive C-21 for book cover bonding is a ethylene-vinyl acetate copolymer with 100% solid content. C-21 is specifically ...
Colle ene ivoire PUR-XBB768 adhésif blanc du travail du bois PUR Edgebanding
Low Cost & High Quality Factory Directly Edgebanding Bonding of Various Substrates to Various Surface Materials PUR Hot Melt WANLI® PUR-XBB768 with Excellent Peeling Strength, Good Heat & Humidity & Chemical Resistance Wanli® PUR hot melt adhesive PUR-XBB768 for edge bonding is a single-component ...
Chips EVA Hot Glue Book Binding, colle EVA-KG-7G d'obligatoire de livre blanc
High Performance & Low Cost, Viscosity 6500±1000mpa·s (160℃) White Chips Bulk WANLI® KG-7G EVA Hot Melt for Normal Paper Book Back Binding with Paper Weight of 70~80G/m² Wanli® EVA hot melt adhesive KG-7G for book back bonding is a ethylene-vinyl acetate copolymer with 100% solid content. KG-7G is ...
